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More about Nickel Plating
Why Nickel
Nickel, the foundation layer. Hard, durable, and the barrier under most precious-metal finishes.
Barrier under gold. Stops copper migrating into thin gold, even at high temperature.
Wire-bond ready. Low-stress sulfamate nickel is a fine-grained underplate for wire-bonding gold.
Electroforms. Sulfamate nickel builds up to 0.020".
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Electroless Nickel
Even coverage. Uniform thickness in holes, recesses and complex shapes.
High or low phosphorus. High phosphorus for corrosion resistance; low phosphorus for hardness and wear.
Solderable. Good solderability and a sound surface for adhesive bonding.
Tough substrates. Plates over aluminum, magnesium and steel.